hlmp-d150/d155, hlmp-k150/k155 t-13/4 (5 mm), t-1 (3 mm), low current, double heterojunction algaas red led lamps data sheet features ? minimumfluminousfintensityfspecifedfatf1fma ? highflightfoutputfatflowfcurrents ? widefviewingfangle ? outstandingfmaterialfefciency ? lowfpower/lowfforwardfvoltage ? cmos/mosfcompatible ? ttlfcompatible ? deepfredfcolor applications ? lowfpowerfcircuits ? batteryfpoweredfequipment ? telecommunicationfindicators description thesef solidf statef ledf lampsf utilizef newlyf developedf doublef heterojunctionf (dh)f algaas/gaasf materialf tech - nology.f thisf ledf materialf hasf outstandingf lightf outputf efciencyfatfveryflowfdrivefcurrents.fthefcolorfisfdeepfredf atf thef dominantf wavelengthf off 637f nanometres.f thesef lampsfarefideallyfsuitedfforfusefinfapplicationsfwherefhighf lightfoutputfisfrequiredfwithfminimumfpowerfoutput. 1.14 (0.045) 0.51 (0.020) 3.43 (0.135) 2.92 (0.115) 24.1 (0.95) min. 4.70 (0.185) 4.19 (0.165) 3.17 (0.125) 2.67 (0.105) 2.79 (0.110) 2.29 (0.090) 1.52 (0.060) 1.02 (0.040) 6.35 (0.250) 5.58 (0.220) 0.55 (0.022) 0.40 (0.016) cathode ? 0.65 (0.026) max. sq. typ. shoulder package dimensions a b c notes: 1.f allfdimensionsfarefinfmillimetersf(inches) 2f anfepoxyfmeniscusfmayfextendfaboutf1mmfdownfthefleads
2 selection guide luminous intensity iv (mcd) at 1 ma package description device hlmp- min. typ. max. 2 1/2 [1] degree package outline t-1f3/4fredftintedfdifused d150f 1.3f 3.0f Cf 65f af d150-c00xxf 1.3f 3.0f Cf 65f af d150-cd0xxf 1.3f 3.0f 4.2f 65f af t-1f3/4fredfuntintedfnin-difused d155f 5.4f 10.0f Cf 24f bf d155-f00xxf 5.4f 10.0f Cf 24f bf t-1fredftintedfdifused k150f 1.3f 2.0f Cf 60f cf k150-c00xxf 1.3f 2.0f Cf 60f cf k150-cd0xxf 1.3f 3.0f 4.2f 60f cf t-1fredfuntintedfnon-difused k155f 2.1f 3.0f Cf 45f cf k155-cd0xxf 1.3f 3.0f 4.2f 45f cf k155-d00xxf 2.1f 3.0f Cf 45f cf k155-de0xxf 2.1f 3.0f 6.8f 45f cf note: 1.f 1/2 fisfthefoffaxisfangleffromflampfcenterlinefwherefthefluminousfintensityfisf 1 / 2 fthefon-axisfvalue. part numbering system hlmp - x 1 xx - x x x xx mechanical option f 00:fbulk f 01:ftapef&freel,fcrimpedfleads f 02:ftapef&freel,fstraightfleads f a1,fb1:frightfanglefhousing,funevenfleads f a2,fb2:frightfanglefhousing,fevenfleads f dd,fdh:fammofpack color bin options f 0:ffullfcolorfbinfdistribution maximum iv bin options f 0:fopenf(nofmax.flimit) f others:fpleasefreferftofthefivfbinftable minimum iv bin options f pleasefreferftofthefivfbinftable lens option f 50:ftinted,fdifused f 55:funtinted,fnondifused package options f d:ft-13/4f(5fmm) f k:ft-1f(3fmm)
3 absolute maximum ratings at t a = 25c parameter value peakfforwardfcurrent [1] f 300fmaf averagefforwardfcurrentf 20fmaf dcfcurrent [2]f 30fmaf powerfdissipationf 87fmwf reversefvoltagef(irf=f100fa)f 5fvf transientfforwardfcurrentf(10fsfpulse) [3 ]f 500fmaf ledfjunctionftemperaturef 110cf operatingftemperaturefrangef -20ftof+100cf storageftemperaturefrangef -40ftof+100cf notes: 1.ff maximumfi peak fatfff=f1fkhz,fdff=f6.7%. 2.ff derateflinearlyfasfshownfinffiguref4. 3.ff theftransientfpeakfcurrentfisfthefmaximumfnon-recurringfpeakfcurrentfthefdevicefcanfwithstandfwithoutfdamagingfthefledfdiefandfwirefbonds.f itfisfnotfrecommendedfthatfthefdevicefbefoperatedfatfpeakfcurrentsfbeyondfthefabsolutefmaximumfpeakfforwardfcurrent. electrical/optical characteristics at t a = 25c symbol description min. typ. max. unit test condition v f f forwardfvoltagef 1.6f 1.8f vf i f f=f1fmaf v r f reversefbreakdownfvoltagef 5.0f 15.0f vf i r f=f100faf p f peakfwavelengthf 645f nmf measurementfatfpeak d f dominantfwavelengthf 637f nmf notef1f ? 1 / 2 f spectralflinefhalfwidthf 20f nmf s f speedfoffresponsef 30f nsf exponentialftimefconstant,fe -t /t s f cf capacitancef 30f pff v f f=f0,fff=f1fmhzf r j-pin f thermalfresistancef 260 [3] ff 210 [4] 290 [5] f f c/wf junctionftofcathodefleadf v f luminousfefcacyf 80f im/wf notef2f notes: 1.f thefdominantfwavelength,f d ,fisfderivedffromfthefciefchromaticityfdiagramfandfrepresentsfthefcolorfoffthefdevice. 2.ff thefradiantfintensity,fi e ,finfwattsfperfsteradian,fmayfbeffoundffromfthefequationfi e f=fl v / v ,fwherefi v fisfthefluminousfintensityfinfcandelasfandf v fis f luminousfefcacyfinflumens/watt. 3.ff hlmp-d150. 4.ff hlmp-d155. 5.ff hlmp-k150/-k155.
4 figure 3. relative luminous intensity vs. dc forward current. figure 4. maximum forward dc current vs. ambient temperature. derating based on tj max. = 110 c. figure 1. relative intensity vs. wavelength. figure 2. forward current vs. forward voltage. figure 5. relative luminous intensity vs. angular displacement. hlmp-d150. figure 6. relative luminous intensity vs. angular displacement. hlmp-k150.
5 figure 7. relative luminous intensity vs. angular displacement. hlmp-d155. figure 8. relative luminous intensity vs. angular displacement. HLMP-K155. intensity bin limits intensity range (mcd) color bin min. max. redf cf 1.5f 2.4f df 2.4f 3.8f ef 3.8f 6.1f ff 6.1f 9.7f gf 9.7f 15.5f hf 15.5f 24.8f if 24.8f 39.6f jf 39.6f 63.4f kf 63.4f 101.5f lf 101.5f 162.4f mf 162.4f 234.6f nf 234.6f 340.0f of 340.0f 540.0f pf 540.0f 850.0f qf 850.0f 1200.0f rf 1200.0f 1700.0f sf 1700.0f 2400.0f tf 2400.0f 3400.0f uf 3400.0f 4900.0f vf 4900.0f 7100.0f wf 7100.0f 10200.0f xf 10200.0f 14800.0f yf 14800.0f 21400.0f zf 21400.0f 30900.0f
6 mechanical option matrix mechanical option code defnition 00f bulkfpackaging,fminimumfincrementf500fpcs/bag 01f tapef&freel,fcrimpedfleads,fminimumfincrementf1300fpcsfforft-1 3 / 4 ,f1800fpcsfforft-1 02 ftapef&freel,fstraightfleads,fminimumfincrementf1300fpcsfforft-1 3 / 4 ,f1800fpcsfforft-1 a1f t-1,frightfanglefhousing,funevenfleads,fminimumfincrementf500fpcs/bag a2f t-1,frightfanglefhousing,fevenfleads,fminimumfincrementf500fpcs/bag b1f t-1 3 / 4 ,frightfanglefhousing,funevenfleads,fminimumfincrementf500fpcs/bag b2f t-1 3 / 4 ,frightfanglefhousing,fevenfleads,fminimumfincrementf500fpcs/bag ddf ammofpack,fstraightfleadsfwithfminimumf2kfincrement dhf ammofpack,fstraightfleadsfwithfminimumf2kfincrement note: allfcategoriesfarefestablishedfforfclassifcationfoffproducts.fproductsfmayfnotfbefavailablefinfallfcategories.fpleasefcontactfyourflocalfavago representativefforffurtherfclarifcation/information.
precautions lead forming ? thefleadsfoffanfledflampfmayfbefpreformedforfcutftof lengthfpriorftofinsertionfandfsolderingfintofpcfboard. ? iffleadfformingfisfrequiredfbeforefsoldering,fcarefmustf bef takenf tof avoidf anyf excessivef mechanicalf stressf inducedftofledfpackage.fotherwise,fcutfthefleadsfoffledf toflengthfafterfsolderingfprocessfatfroomftemperature.f thef solderf jointf formedf willf absorbf thef mechanicalf stressfoffthefleadfcuttingffromftravelingftofthefledfchipf diefattachfandfwirebond. ? itfisfrecommendedfthatftoolingfmadeftofpreciselyfformf andfcutfthefleadsftoflengthfratherfthanfrelyfuponfhandf operation. soldering conditions ? carefmustfbeftakenfduringfpcbfassemblyfandfsolderingf processftofpreventfdamageftofledfcomponent. ? thef closestf ledf isf allowedf tof solderf onf boardf isf 1.59f mmf belowf thef bodyf (encapsulantf epoxy)f forf thosef partsfwithoutfstandof. ? recommendedfsolderingfconditions: wave soldering manual solder dipping pre-heatftemperaturef 105fcfmax.f C pre-heatftimef 30fsecfmax.f C peakftemperaturef 250fcfmax.f 260fcfmax. dwellftimef3 fsecfmax.f 5fsecfmax. ? wavefsolderingfparameterfmustfbefsetfandfmaintainedf accordingf tof recommendedf temperaturef andf dwellf timef inf thef solderf wave.f customerf isf advisedf tof periodicallyf checkf onf thef solderingf proflef tof ensuref thef solderingf proflef usedf isf alwaysf conformingf tof recommendedfsolderingfcondition. ? iff necessary,f usef fxturef tof holdf thef ledf componentf inf properf orientationf withf respectf tof thef pcbf duringf solderingfprocess. ? properf handlingf isf imperativef tof avoidf excessivef thermalf stressesf tof ledf componentsf whenf heated.f therefore,fthefsolderedfpcbfmustfbefallowedftofcoolftof roomftemperature,f25c,fbeforefhandling. ? specialf attentionf mustf bef givenf tof boardf fabrication,f solderfmasking,fsurfacefplatingfandfleadfholesfsizefandf componentforientationftofassurefsolderability. ? recommendedfpcfboardfplatedfthroughfholefsizesfforf ledfcomponentfleads: led component lead size diagonal plated through hole diameter 0.457fxf0.457fmm (0.018fxf0.018finch 0.646fmm (0.025finch) 0.976ftof1.078fmm (0.038ftof0.042finch) 0.508fxf0.508fmmf (0.020fxf0.020finch)f 0.718fmmf (0.028finch)f 1.049ftof1.150fmm (0.041ftof0.045finch)f note:f referftofapplicationfnotefan1027fforfmorefinformationfonfsoldering ledfcomponents. for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 2005-2008 avago technologies. all rights reserved. obsoletes 5898-4249en av02-1562en - september 23, 2008 figure 9. recommended wave soldering profle. laminar wa ve bo tt om side of pc bo ard ho t air knife turbulent wa ve fluxing prehea t 0 1 0 2 0 30 50 100 150 200 250 30 40 50 time ? seconds tempera ture ? c 60 70 80 90 100 t op side of pc bo ard convey or speed = 1.83 m/min (6 ft/min) prehea t setting = 150 c (100 c pcb) solder wa ve tempera ture = 245 c air knife air tempera ture = 390 c air knife dist ance = 1.91 mm (0.25 in.) air knife angle = 40 solder: sn63; flux: rma no te: allo w for bo ards to be sufficientl y cooled before exer ting mechanical force.
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